Compounds
Variety of molding compounds are available depending on the applications demands.
PF-Phenolic Novolac
Phenolic novolac molding compounds are reinforced with carbon fiber, glass fiber, organic filler or inorganic filler. SBHPP Phenolic Molding Compounds have excellent heat resistance, mechanical strength and electrical properties and are used in automotive, electronics and industrial market for many years.
Long Fiber reinforced (5), Short Fiber reinforced (93), Inorganic filler (18), Unfilled or organic filler (19)
DAP-Diallyl Phtalate
DAP molding compounds are reinforced with glass fiber, organic filler or inorganic filler. Good electrical properties such as tracking resistance over 600V. Good dimensional stability, good processability. The chemistry of the resin system enables the parts molded from these compounds to retain their superior insulating properties, even when subjected to extreme environmental conditions of high heat and high humidity over long time periods.
Long Fiber reinforced (4), Short Fiber reinforced (16), Inorganic filler (4)
UP-Unsatured Polyester
Unsaturated Polyester molding compounds are reinforced with glass fiber, organic filler or inorganic filler. They have excellent electrical properties such as arc resistance (180sec) and tracking resistance (+600V).
PC-Polycarbonate
Heat dissipative polycarbonate molding compounds.
Inorganic filler (1)
PF-Phenolic Resol
Phenolic resol molding compounds are based on resol (non-ammonia) resin and are reinforced with glass fiber, organic filler or inorganic filler. Non-ammonia grades have extremely low metal corrosion and excellent electrical properties.
Short Fiber reinforced (22), Inorganic filler (1), Unfilled or organic filler (1)
SI-Silicone
Silicone molding compounds refer to Glass Fiber, mineral and organic reinforced material based on silicone resin, this is not a range of silicone rubber. They exhibit very high-temperature performance (>300°C) as well as good electrical properties. Typical application are firestop systems, nuclear industry components or electrical insulation for Military & Aerospace industries.
Long Fiber reinforced (2), Short Fiber reinforced (3)
PPS-Polyphenylene Sulfide
Polyphenylene sulfide (PPS) based molding compounds with high heat resistance and chemical resistance. SBHPP offer optimized materials for niche applications with our unique formulation technology.
Short Fiber reinforced (2), Inorganic filler (6), Unfilled or organic filler (4)
EP-Epoxy
Epoxy molding compounds are reinforced with glass fiber, organic filler or inorganic filler. Excellent electrical properties such as withstand voltage and corona resistance. Epoxy compounds exhibit very low viscosity when filling a mold and therefore offer the designer flexibility in encapsulating sensitive electronic components and in forming high-density pin connectors.
Long Fiber reinforced (10), Short Fiber reinforced (23), Inorganic filler (2), Unfilled or organic filler (3)
BMI-Bismaleimide
High Performance Polyimide (BMI) molding compounds are long fiber reinforced molding polymers offering a wide range of high class properties from cryogenic to very high temperatures. They are based on polybismaleimide thermoset resins. Polyimide (BMI) plastics are well known for their very high thermal stability & resistance, and for their excellent mechanical properties assoiciated with a good chemical resistance.
PA-Polyamide
Niche Polyamide molding compounds having high electrical conductivity or heavy weigth.
Inorganic filler (2)