Variety of molding compounds are available depending on the applications demands.
Phenolic novolac molding compounds are reinforced with carbon fiber, glass fiber, organic filler or inorganic filler. SBHPP Phenolic Molding Compounds have excellent heat resistance, mechanical strength and electrical properties and are used in automotive, electronics and industrial market for many years.
DAP molding compounds are reinforced with glass fiber, organic filler or inorganic filler. Good electrical properties such as tracking resistance over 600V. Good dimensional stability, good processability. The chemistry of the resin system enables the parts molded from these compounds to retain their superior insulating properties, even when subjected to extreme environmental conditions of high heat and high humidity over long time periods.
Unsaturated Polyester molding compounds are reinforced with glass fiber, organic filler or inorganic filler. They have excellent electrical properties such as arc resistance (180sec) and tracking resistance (+600V).
Heat dissipative polycarbonate molding compounds.
Inorganic filler (1)
Phenolic resol molding compounds are based on resol (non-ammonia) resin and are reinforced with glass fiber, organic filler or inorganic filler. Non-ammonia grades have extremely low metal corrosion and excellent electrical properties.
Silicone molding compounds refer to Glass Fiber, mineral and organic reinforced material based on silicone resin, this is not a range of silicone rubber. They exhibit very high-temperature performance (>300°C) as well as good electrical properties. Typical application are firestop systems, nuclear industry components or electrical insulation for Military & Aerospace industries.
Polyphenylene sulfide (PPS) based molding compounds with high heat resistance and chemical resistance. SBHPP offer optimized materials for niche applications with our unique formulation technology.
Epoxy molding compounds are reinforced with glass fiber, organic filler or inorganic filler. Excellent electrical properties such as withstand voltage and corona resistance. Epoxy compounds exhibit very low viscosity when filling a mold and therefore offer the designer flexibility in encapsulating sensitive electronic components and in forming high-density pin connectors.
High Performance Polyimide (BMI) molding compounds are long fiber reinforced molding polymers offering a wide range of high class properties from cryogenic to very high temperatures. They are based on polybismaleimide thermoset resins. Polyimide (BMI) plastics are well known for their very high thermal stability & resistance, and for their excellent mechanical properties assoiciated with a good chemical resistance.
Niche Polyamide molding compounds having high electrical conductivity or heavy weigth.
Inorganic filler (2)
- VYNTEC CF8050 is a Carbon Fiber molding compound
(produced inEurope )
- VYNTEC CF8131 is a Carbon Fiber molding compound
(produced inEurope )
- X-28057-2HT is a Short Glass Fiber Epoxy Molding Compound, Hole Fill
(produced inAmericas )