EP, molding compound, from Americas, updated 16 March 2015EPIALL 2061B-1 is a Encapsulation-grade Epoxy Molding Compound
Main featuresEPIALL 2061B-1 is a Encapsulation-grade Epoxy Molding Compound based on Epoxy (TS) polymer. It is supplied in the form of Granular/Molding Powder for Molding.
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