Circuitry Materials
Variety of circuitry laminates are available in different forms depending on the applications demands.
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Epoxy resin Copper-clad Laminates
Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.
SBHPP sells those products worldwide under SUMILITE®ELC brandname.
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Epoxy resin Copper-clad Multilayer Laminates
Epoxy resin multi-layer material for PCBs developed based on our resin formulation technology.
SBHPP sells those products worldwide under SUMILITE®ELC brandname.
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Phenolic resin Copper-clad Laminates
Phenolic resin copper-clad laminates produced by stringent quality assurance system.
SBHPP sells those products worldwide under SUMILITE®PLC brandname.
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Unclad Laminates
Suitable for switches, volumes, terminal boards, distributor boards, jigs, insulation plates for molds and dies.
SBHPP sells those products worldwide under SUMILITE®PL and SUMILITE®EL brandnames.
| Resin type | Unclad | Copper-clad (single or double sided)
| Prepreg |
|---|---|---|---|
| Paper Phenolic |  |
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| Glass Epoxy | |
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| Aluninum base | |
Features
- FR1, FR4 or CEM3 types
- Halogen free, lead free solder applicable types
- Anti tracking types
