Circuitry Materials

Variety of circuitry laminates are available in different forms depending on the applications demands.

  • Epoxy resin Copper-clad Laminates

    Double sided Epoxy resin copper-clad laminate suitable for wide range of applications.

    SBHPP sells those products worldwide under SUMILITE®ELC brandname.

  • Epoxy resin Copper-clad Multilayer Laminates

    Epoxy resin multi-layer material for PCBs developed based on our resin formulation technology. 

    SBHPP sells those products worldwide under SUMILITE®ELC brandname.

  • Phenolic resin Copper-clad Laminates

    Phenolic resin copper-clad laminates produced by stringent quality assurance system.

    SBHPP sells those products worldwide under SUMILITE®PLC brandname.

  • Unclad Laminates

    Suitable for switches, volumes, terminal boards, distributor boards, jigs, insulation plates for molds and dies.

    SBHPP sells those products worldwide under SUMILITE®PL and SUMILITE®EL brandnames.

Available molding compounds types
Resin typeUnclad
Copper-clad
(single or double sided)
Prepreg
Paper Phenolic  
Glass Epoxy
Aluninum base    

Features

  • FR1, FR4 or CEM3 types
  • Halogen free, lead free solder applicable types
  • Anti tracking types

SBHPP-Business Unit of Sumitomo Bakelite Co., Ltd.

© SBHPP 2017
High Performance Plastics | Business unit of 
Sumitomo Bakelite Co., Ltd. SUMITOMO BAKELITE CO.,LTD.