Thermoset Molding Compounds

  • Overview

    SBHPP Engineering Thermoset molding materials are produced from four resins: Phenolic, Epoxy, DAP and Silicone, compounded with various reinforcements and fillers. The resulting composites meet some of the most demanding engineering requirements.
    SBHPP Engineering Thermosets are excellent replacements for metallic or thermoplastic components and offer high temperature resistance, mechanical strength, electrical insulation, chemical resistance and other important properties.

    • Phenolic Compounds

      Phenolic compounds offer outstanding dimensional stability and resistance to creep under dynamic and static loads at elevated temperatures.

    • Epoxy Compounds

      Epoxy is the premier material for military firewall connectors and is also used extensively in the encapsulation of electronic components.

    • Diallyl-Phthalate Compounds

      DAP has long been the material of choice for critical high-performance military and commercial electrical components where long-term reliability is demanded.

    • Silicone Compounds

      Silicone molding compounds are noted for maximum heat resistance, and are used in insulators for military and commercial applications.

    • Phenolic molding compounds

      SBHPP Phenolic Molding Compounds have excellent heat resistance, mechanical strength and electrical properties and are used in automotive, aerospace, electronics and industrial market for many years. Phenolic molding compounds are reinforced with carbon fiber, glass fiber, organic filler or inorganic filler.

      They are based on two types of resins; resol resin (non-ammonia) or novolac resin.


      Key properties:

      • High mechanical strength
      • Excellent temperature resistance
      • Excellent dimensional stability
      • Excellent creep resistance, which can be optimised by postcuring
      • Very low expansion coefficient
      • Very low water absorption
      • Very good electrical insulation
      • Good resistance to most chemicals
      Application example:
      Automotive - disk brake caliper piston made in Mineral and Glass Fiber Phenolic material.

    • Epoxy molding compounds

      Excellent electrical properties such as withstand voltage and corona resistance. Epoxy compounds exhibit very low viscosity when filling a mold and therefore offer the designer flexibility in encapsulating sensitive electronic components and in forming high-density pin connectors.

      Molding compounds are reinforced with glass fiber, organic filler or inorganic filler.


      Key properties:

      • Glass transition temperatures of 155°C - 175°C - Resistance to thermal shock
      • High Electrical insulation resistance even after long exposure to high temperature and humidity
      • Low dielectric loss - High Arc resistance - even under adverse conditions
      • Highly resistant to many solvent, degreasing compounds and plating baths
      • Compatible with magnet wire (used with coil bobbins) as epoxy doesn't outgas elements
      • Low outgasing in high vacuum
      • Unaffected by sea water - Non corrosive to metal inserts
      Application example:
      Cover with hall effect sensor overmolded with Glass Fiber Epoxy material.

    • Diallyl Phathalate molding compounds

      Good electrical properties such as tracking resistance over 600V. Good dimensional stability, good processability. The chemistry of the resin system enables the parts molded from these compounds to retain their superior insulating properties, even when subjected to extreme environmental conditions of high heat and high humidity over long time periods. Additionally, DAP compounds will resist dimensional change in high-heat soldering environments where competitive materials may warp.

      Molding compounds are reinforced with glass fiber, organic filler or inorganic filler.


      Key properties:

      • Virtually no post-mold shrinkage
      • FS-10-VO-200: 200°C UL® temperature index - Isophthalate (DAIP) materials are recommended for very high temperature applications
      • Highly resistant to solvents, acids, alkalies, fuels, hydraulic fluids, plating chemicals and sterilizing solutions
      • High impact resistance
      • Highly resistant to sudden, extreme jolts and severe stresses
      • Fungus resistance - Inert to fungus growth
      Application example:
      High density connectors, bobbins, switches made with Short Glass Fiber DAP material.

    • Silicone molding compounds

      Excellent heat resistance, electrical properties and impact resistance. Silicone molding compounds refer to glass fiber and mineral reinforced material based on silicone resin, this is not a range of silicone rubber.
      They exhibit very high-temperature performance (>300°C) as well as good electrical properties.

      Typical application are firestop systems, nuclear industry components or electrical insulation for Military & Aerospace industries.
      Molding compounds are reinforced with glass fiber, organic filler or inorganic filler.


      Key properties:

      • Very high-impact strength, up to 5.0 ft. lb/in.
      • Temperature resistance up to 315°C (600°F)
      • ASTM D-5948 - SI9041 material meets MSI-30
      Application example:
      Small aeronautic connectors made with Short Glass Fiber Silicone material.

    • Unsaturated Polyester molding compounds

      Excellent electrical properties such as arc resistance and tracking resistance.

      Molding compounds are reinforced with glass fiber, organic filler or inorganic filler.


      Key properties:

      • High arc resistance, up to 180 sec
      • High tracking resistance, up to 600V

  • Uses & applications

    Our materials enhance innovations

    SBHPP proves everyday its strength as development partner with high-performance polymers and a highly capable and motivated team. For a variety of industries, our materials are providing innovation, high performance, reliability and cost efficiency.

    An overview of some typical applications:


    Automotive

    SBHPP thermoset molding compounds are primarily used in under-the-hood applications. This is a severe environment requiring a high level of thermal, mechanical, dimensional and chemical resistance properties that cannot be matched by other materials. New applications continue to arise from new automotive technologies, as well as continued cost reduction and performance improvement requirements. Thermosets can offer cost reduction vs. steel or diecast aluminum, and performance improvements vs. thermoplastics.

    Phenolic disc brake caliper pistons molded in SBHPP material set the standard in the North American automotive industry and constantly gains market share in other countries.

     Products focus

    • Phenolic grades (carbon, glass & mineral reinforced)
    • Epoxy grades (carbon, glass & mineral reinforced)

    Electrical & Electronics

    Electrical & Electronics are and remain a strong field of SBHPP molding compound applications - from epoxy encapsulated electronics to phenolic commutator materials for DC electric motors.

    Silicone and DAP molding compounds are also widely used for connector insulation that requires high specifications in severe environment.

     Products focus

    • Phenolic grades (glass & mineral reinforced)
    • Epoxy grades (glass & mineral reinforced)
    • Diallyl Phthalate grades (glass & mineral reinforced)
    • Silicone grades (glass & mineral reinforced)

    Aerospace & Transportation

    SBHPP molding compounds are an excellent fit in this industry, which requires the highest level of performance and reliability. Ultra low FST properties (flame, smoke & toxicity) can be achieved with phenolic grades.

    Many products meet ASTM D-5948 Specifications (formerly MIL-M-14).

     Products focus

    • Phenolic grades (carbon, glass & mineral reinforced)
    • Epoxy grades (glass & mineral reinforced)
    • Diallyl Phthalate grades (glass & mineral reinforced)
    • Silicone grades (glass & mineral reinforced)

    Oil & Gas

    SBHPP molding compounds are perfectly suited to the aggressive downhole environment of oil field service tool components, and a variety of other Oil & Gas applications.

    Applications: Medium-performance downhole tool components & frac balls, cement plug cores, plunger/cage assemblies

     Products focus

    • Phenolic grades (glass & mineral reinforced)
    • General purpose Phenolic grades

    Building & Construction, Industrial

    Our thermosets offer solutions to meet the requirements of a wide variety of appliance, industrial and consumer applications.

    Due to their superior tolerance for heat and moisture, combined with good thermal and electrical insulating properties, phenolic composites are preferred materials for use in small appliances. Appliance applications include knobs, handles and heated components for toaster, boilers, steam irons, as well as thermostats, motor housings, and timer cases.
    Our materials also provide solutions for a wide variety of construction, industrial and consumer goods.
    The numerous applications for SBHPP materials include compressors, gear systems, fluid engineering, household equipment, abrasives and power tools.

     Products focus

    • Phenolic grades (general purpose, glass & mineral reinforced)
    • Epoxy grades (glass & mineral reinforced)
    • Diallyl Phthalate grades (glass & mineral reinforced)
    • Silicone grades (glass & mineral reinforced)
    • Unsaturated Polyester grades (glass & mineral reinforced)
  • With manufacturing, sales, support and administrative offices spanning across the globe, our team will answer all your questions and find solutions for any project.

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High Performance Plastics | Business unit of 
Sumitomo Bakelite Co., Ltd. SUMITOMO BAKELITE CO.,LTD.